Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-10-30
2007-10-30
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S110000, C438S111000, C438S112000, C438S113000, C438S121000, C438S124000
Reexamination Certificate
active
11123567
ABSTRACT:
Arrangements and methods of packaging integrated circuits in leadless leadframe packages configured for maximizing a die size are disclosed. The package is described having an exposed die attach pad and a plurality of exposed contacts formed from a common substrate material. The contacts, however, are thinned relative to the die attach pad. In one embodiment, an inner region of the contacts is thinned. In another embodiment, an outer region of the contacts is also thinned. A die is mounted on the die attach pad and wire bonded to the contacts. Since the inner region and sometimes together with the outer region of the contact are lower than the die attach pad being wire bonded to, the size of the die can be relatively increased to overhang over the contact, thereby maximizing the die size in the package. A plastic cap is molded over the die, contacts, and bonding wires while leaving the bottom surface of the contacts exposed.
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Fields Gerald Alexander
Mostafazadeh Shahram
Au Bac H.
Beyer & Weaver, LLP
National Semiconductor Corporation
Smith Zandra V.
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