Leadless package system having external contacts

Details Leadless package system having external contacts Leadless package system having external contacts

2011-08-09

2011-08-09

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S125000, C438S126000, C438S127000, C438S118000, C257S738000, C257S692000, C257S736000, C257S737000, C257S773000, C257S778000, C257S784000, C257S787000, C257SE23046, C257SE23124

Reexamination Certificate

active

07993979

ABSTRACT:
A leadless package system includes: providing a chip carrier having indentations defining a pattern for a protrusion for external contact terminals; placing an external coating layer in the indentations in the chip carrier; layering a conductive layer on top of the external coating layer; depositing an internal coating layer on the conductive layer; patterning the internal coating layer and the conductive layer to define external contact terminals with a T-shape profile; connecting an integrated circuit die to the external contact terminals; encapsulating the integrated circuit die and external contact terminals; and separating the chip carrier from the external coating layer.

REFERENCES:
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 5847458 (1998-12-01), Nakamura et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6333252 (2001-12-01), Jung et al.
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6759271 (2004-07-01), Miyazaki
patent: 6933594 (2005-08-01), McLellan et al.
patent: 6969905 (2005-11-01), Paulus
patent: 7049177 (2006-05-01), Fan et al.
patent: 2002/0027010 (2002-03-01), Glenn
patent: 2007/0052076 (2007-03-01), Ramos et al.
patent: 2007/0090495 (2007-04-01), Kim et al.

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