Leadframe alteration to direct compound flow into package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S667000, C257S674000, C257SE23048, C257SE21510

Reexamination Certificate

active

11215233

ABSTRACT:
A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at a first transition point. The upward slope facilitates the upward flow of the molding compound entering from a bottom gate. Likewise, the leadframe also directs flow in a top gated mold by reversing the orientation of the leadframe or by forming a reverse downset on the leadframe.

REFERENCES:
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5197183 (1993-03-01), Chia et al.
patent: 5252784 (1993-10-01), Asai et al.
patent: 5661337 (1997-08-01), Manteghi
patent: 5663104 (1997-09-01), Fukuyama
patent: 5684327 (1997-11-01), Nakazawa et al.
patent: 5753977 (1998-05-01), Kusaka et al.
patent: 5754977 (1998-05-01), Kusaka et al.
patent: 5777380 (1998-07-01), Otsuki et al.
patent: 5783860 (1998-07-01), Jeng et al.
patent: 5872395 (1999-02-01), Fujimoto
patent: 5926695 (1999-07-01), Chu et al.
patent: 5932923 (1999-08-01), Kim et al.
patent: 5936837 (1999-08-01), Scribner et al.
patent: 5965078 (1999-10-01), Bolanos et al.
patent: 5973407 (1999-10-01), Tzu et al.
patent: 6057595 (2000-05-01), Pohl et al.
patent: 6278175 (2001-08-01), James
patent: 6451629 (2002-09-01), James
patent: 7053467 (2006-05-01), James
patent: 2001/0053566 (2001-12-01), James

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Leadframe alteration to direct compound flow into package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe alteration to direct compound flow into package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe alteration to direct compound flow into package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3742742

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.