Leadframe alteration to direct compound flow into package

Details Leadframe alteration to direct compound flow into package Leadframe alteration to direct compound flow into package

2007-09-18

2007-09-18

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S667000, C257S674000, C257SE23048, C257SE21510

Reexamination Certificate

active

11215233

ABSTRACT:
A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at a first transition point. The upward slope facilitates the upward flow of the molding compound entering from a bottom gate. Likewise, the leadframe also directs flow in a top gated mold by reversing the orientation of the leadframe or by forming a reverse downset on the leadframe.

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