Leadframe finger support

Details Leadframe finger support Leadframe finger support

1998-09-15

1999-07-27

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

257666, 257667, 257690, 257784, 361813, H01L 2148

Patent

active

059306025

ABSTRACT:
A leadframe includes a leadframe finger support for supporting elongate leadframe fingers. These elongate leadframe fingers are subject to damage prior to or during the assembly process. Through the provision of the leadframe finger support, the leadframe fingers may be supported at an intermediate position along their length as necessary to prevent bending. The support may be severed from the dam bar in the course of singulation.

REFERENCES:
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5150194 (1992-09-01), Brooks et al.

Affiliated with

Also associated with

Rating

Leadframe finger support does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe finger support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe finger support will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-891410