Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-05-07
1999-10-26
Graybill, David E.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438120, 29 2501, H01L 2152, H01L 2158, H01L 2160
Patent
active
059727381
ABSTRACT:
A PBGA package includes PBGA member, a stiffener ring, and a stiffener fixture which includes a retaining recess having a floor for receiving the stiffener ring and includes a ledge positioned above the recess floor for receiving the PBGA member. An adhesive layer is applied to the stiffener ring, which is adhered to the PBGA member. The stiffener ring and PBGA member are essentially coplanar to less than 8 mils. A top plate is placed on top of the PBGA member and the ring and member are secured together tightly.
REFERENCES:
patent: 3435516 (1969-04-01), Kilby
patent: 3885304 (1975-05-01), Kaiser et al.
patent: 4218701 (1980-08-01), Shirasaki
patent: 4264917 (1981-04-01), Ugon
patent: 4372037 (1983-02-01), Scapple et al.
patent: 4558510 (1985-12-01), Tani et al.
patent: 4814943 (1989-03-01), Okuaki
patent: 5041395 (1991-08-01), Steffen
patent: 5057460 (1991-10-01), Rose
patent: 5173766 (1992-12-01), Long et al.
patent: 5219794 (1993-06-01), Satoh et al.
patent: 5436203 (1995-07-01), Lin
patent: 5547730 (1996-08-01), Weiblen et al.
patent: 5610442 (1997-03-01), Schneider et al.
patent: 5616520 (1997-04-01), Nishiuma et al.
patent: 5700697 (1997-12-01), Dlugokecki
patent: 5786631 (1998-07-01), Fishley et al.
patent: 5804467 (1998-09-01), Kawahara et al.
Bacher Brent
Sumagaysay Felipe
Vongfuangfoo Sutee
Graybill David E.
LSI Logic Corporation
LandOfFree
PBGA stiffener package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with PBGA stiffener package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and PBGA stiffener package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-763365