Packaged semiconductor with coated leads and method therefore

Details Packaged semiconductor with coated leads and method therefore Packaged semiconductor with coated leads and method therefore

2006-09-12

2006-09-12

Andujar, Leonardo (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000, C438S015000

Reexamination Certificate

active

07105383

ABSTRACT:
A semiconductor die is housed in a package body. Leads, which are electrically coupled to the semiconductor die, extend from the package body and are for connecting to a printed circuit board or other device. The leads are coated with a material that protects the leads from oxidation. The coating is compatible with solder techniques that are commonly used to attach packaged semiconductors to a printed circuit board. In some examples, the coating is removable, after drying, at temperatures below one hundred eighty degrees Celsius. This allows for solder processes, which are typically at least 180° C., to remove the coating thereby exposing the leads, which has been protected from oxidation, so that it can be soldered to the printed circuit board. In some examples, the coating material includes an organic material. In some examples, the coating material is an organic solderability preservative (OSP).

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Entek® Plus CU-106A—PWB Copper Protective Coating (Data Sheet); © 2000, Enthone-OMI, Inc.; Issued Aug. 3, 2000; 9 Pages.

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