Plastic overmolded packages with mechancially decoupled lid...

Details Plastic overmolded packages with mechancially decoupled lid... Plastic overmolded packages with mechancially decoupled lid...

2008-08-15

2009-12-15

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S704000, C257S707000, C257S713000, C257S724000, C257SE23103, C361S709000, C361S711000

Reexamination Certificate

active

07632717

ABSTRACT:
The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

REFERENCES:
patent: 6535388 (2003-03-01), Garcia
patent: 7315080 (2008-01-01), Fan et al.
patent: 7332823 (2008-02-01), Khaw et al.
patent: 7423341 (2008-09-01), Crispell et al.
patent: 2005/0161780 (2005-07-01), Wang et al.
patent: 2007/0158823 (2007-07-01), Dani et al.
patent: 06132425 (1994-05-01), None

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