Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-05-10
2011-05-10
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S666000
Reexamination Certificate
active
07939378
ABSTRACT:
A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
REFERENCES:
patent: 4800178 (1989-01-01), Mathew et al.
patent: 5360991 (1994-11-01), Abys et al.
patent: 5521432 (1996-05-01), Tsuji et al.
patent: 5563442 (1996-10-01), Mahulikar et al.
patent: 5635755 (1997-06-01), Kinghorn
patent: 5660708 (1997-08-01), Tezuka et al.
patent: 5675177 (1997-10-01), Abys et al.
patent: 5767574 (1998-06-01), Kim et al.
patent: 5854511 (1998-12-01), Shin et al.
patent: 5882955 (1999-03-01), Huang et al.
patent: 5977620 (1999-11-01), Kim et al.
patent: 6002179 (1999-12-01), Chan et al.
patent: 6087712 (2000-07-01), Kim et al.
patent: 6139977 (2000-10-01), Abys et al.
patent: 6150711 (2000-11-01), Kom et al.
patent: 6232651 (2001-05-01), Lee et al.
patent: 6245448 (2001-06-01), Abbott
patent: 6518653 (2003-02-01), Takagi
patent: 6521358 (2003-02-01), Tanaka et al.
patent: 6953986 (2005-10-01), Abbott et al.
patent: 360060742 (1985-04-01), None
Abott, “Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe”, 1997, Applied Physics Letter,p. 61-66.
Abbott Donald C
Mitchell Michael E
Moehle Paul R
Romm Douglas W
Brady III Wade J.
Landau Matthew C
Mitchell James M
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
LandOfFree
Palladium-spot leadframes for high adhesion semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Palladium-spot leadframes for high adhesion semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Palladium-spot leadframes for high adhesion semiconductor... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2620823