Packaged integrated circuit with enhanced thermal dissipation

Details Packaged integrated circuit with enhanced thermal dissipation Packaged integrated circuit with enhanced thermal dissipation

2008-02-19

2009-08-11

Tran, Thien F (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S127000

Reexamination Certificate

active

07572680

ABSTRACT:
A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors may be bond wires or conductive stud bumps and do not extend beyond a lateral edge of the die. One or more of the thermal conductors may be looped within the encapsulant and exposed at an upper surface of the encapsulant. In one form a heat spreader (68) is placed overlying the encapsulant for further heat removal. In another form the heat spreader functions as a power or ground terminal directly to points interior to the die via the thermal conductors. Active bond pads may be placed exclusively along the die's periphery or also included within the interior of the die.

REFERENCES:
patent: 6597065 (2003-07-01), Efland
patent: 6707140 (2004-03-01), Nguyen et al.
patent: 2005010989 (2005-02-01), None

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