Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

2008-03-25

2011-10-25

Trinh, Hoa B (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23117

Reexamination Certificate

active

08043899

ABSTRACT:
A photosensitive resin composition comprising a photosensitive silicone compound of specified molecular weight having any of specified photosensitive substituents and a photopolymerization initiator in any of specified proportions is used. Thus, there can be obtained a resin composition containing a photosensitive silicone compound that provides a material suitable for a rewiring layer or a buffer coat material of LSI chip, less in a film loss between before and after curing and improved in the stickiness of pre-exposure stage. Further, there can be obtained a resin insulating film utilizing the resin composition.

REFERENCES:
patent: 6984483 (2006-01-01), Roscher et al.
patent: 7674566 (2010-03-01), Shibui
patent: 2005/0244658 (2005-11-01), Bae et al.
patent: 2008/0108723 (2008-05-01), Taniguchi et al.
patent: 2009/0029287 (2009-01-01), Kobayashi et al.
patent: 2 378 756 (2001-01-01), None
patent: 63-121043 (1988-05-01), None
patent: 2005-298800 (2005-10-01), None
patent: 2007-226209 (2007-09-01), None
patent: WO-01/04186 (2001-01-01), None

Affiliated with

Also associated with

Rating

Photosensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4253647