Packaging method for segregating die paddles of a leadframe

Details Packaging method for segregating die paddles of a leadframe Packaging method for segregating die paddles of a leadframe

2006-02-22

2008-11-25

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21499

Reexamination Certificate

active

07456053

ABSTRACT:
A packaging method for segregating die paddles of a leadframe, includes (a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality of die paddles, wherein at least two of the die paddles are connected to each other by at least one connecting bar; (b) attaching a plurality of dies onto the die paddles; (c) forming a molding compound to encapsulate the dies on the die paddles, and exposing the bottom surface of the connecting bar outside the molding compound; and (d) removing part of the connecting bar so as to segregate the die paddles. The die paddles are thus rendered stable during the steps of die attaching, wire bonding and molding, and the yield is raised.

REFERENCES:
patent: 6380048 (2002-04-01), Boon et al.
patent: 6498099 (2002-12-01), McLellan et al.
patent: 7247526 (2007-07-01), Fan et al.

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