Physical quantity sensor, lead frame, and manufacturing...

Details Physical quantity sensor, lead frame, and manufacturing... Physical quantity sensor, lead frame, and manufacturing...

2011-01-11

2011-01-11

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S051000, C438S124000, C257SE23047

Reexamination Certificate

active

07867827

ABSTRACT:
A physical quantity sensor is constituted using a lead frame having at least one stage and a plurality of leads whose bases are arranged in the same plane, wherein at least one physical quantity sensor chip having a plurality of electrode pads is mounted on the stage and is inclined so that the electrode pads are disposed in the inclination direction and are connected to the leads by use of wires whose lengths substantially match distances between the electrode pads and leads. This prevents the leads and wires from being unexpectedly broken, and it is possible to avoid the occurrence of separation of the leads from the physical quantity sensor chip. In addition, the tip ends of the leads are disposed along the surface of the inclined stage before wire bonding; hence, it is possible to easily connect the tip ends of the leads to the physical quantity sensor chip.

REFERENCES:
patent: 4485548 (1984-12-01), Janisiewicz
patent: 5866818 (1999-02-01), Sumi et al.
patent: 6035712 (2000-03-01), Ohta et al.
patent: 6115261 (2000-09-01), Platt et al.
patent: 6937010 (2005-08-01), Takashima et al.
patent: 7000470 (2006-02-01), Iijima et al.
patent: 7187063 (2007-03-01), Adachi et al.
patent: 7494838 (2009-02-01), Adachi et al.
patent: 2004/0103530 (2004-06-01), Adachi et al.
patent: 2004/0150390 (2004-08-01), Tsuge et al.
patent: 2006/0012364 (2006-01-01), Tamura
patent: S63-187352 (1988-11-01), None
patent: 09-236616 (1997-09-01), None
patent: H09-292408 (1997-11-01), None
patent: 2002-156204 (2002-05-01), None
patent: 2004-119819 (2004-04-01), None
patent: 2004-125778 (2004-04-01), None
patent: 2004-128473 (2004-04-01), None

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