Package for high frequency usages and its manufacturing method

Details Package for high frequency usages and its manufacturing method Package for high frequency usages and its manufacturing method

2006-05-09

2009-12-15

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23101, C257SE23103

Reexamination Certificate

active

07632716

ABSTRACT:
A package for high frequency usages10has a notched area16on each longitudinal end of a substantially rectangular heat sink plate11for fastening the package to a base20with a screw. The package includes a joined member17formed by joining a surface of a ring-like frame member12made of a ceramic material to the longitudinal center of a surface of heat sink plate11and joining another surface to an external connection terminal15. The other surface of heat sink plate11presents a curved protruding shape18bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape18causes at least an area of the other surface heat sink plate11that corresponds to an area dedicated for mounting a semiconductor device19within ring-like frame member12to make a close contact with base20when the package is fastened to base20by the screw at notched areas16.

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Patent Abstracts of Japan for JP2001-230349 published on Aug. 24, 2001.

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