Plastic lead frames for semiconductor devices, packages...

Details Plastic lead frames for semiconductor devices, packages... Plastic lead frames for semiconductor devices, packages...

2005-03-29

2005-03-29

Zarneke, David A. (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

Reexamination Certificate

active

06872600

ABSTRACT:
A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

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