Semiconductor/printed circuit board assembly, and computer...

Semiconductor/printed circuit board assembly, and computer...

Sensor module and method of manufacturing same

Shielded laminated structure with embedded chips

Shock-resistant semiconductor device and method for...

Simplified multichip packaging and package design

Simultaneous bumping/bonding process utilizing edge-type...

Single chip modules, repairable multichip modules, and methods o

Single-melt enhanced reliability solder element interconnect

Solder ball excellent in micro-adhesion preventing...

Solder ball landpad design to improve laminate performance

Solder pillar bumping and a method of making the same

Solder wall structure in flip-chip technologies

Soldering method and apparatus for a chip and electronic...

Spacer - connector stud for stacked surface laminated...

Spacer plate solder ball placement fixture and methods therefor

Stack package using anisotropic conductive film (ACF) and...

Stack package using anisotropic conductive film (ACF) and...

Stack-type semiconductor package, method of forming the same...

Stackable ceramic FBGA for high thermal applications