Shielded laminated structure with embedded chips

Details Shielded laminated structure with embedded chips Shielded laminated structure with embedded chips

2005-12-13

2005-12-13

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S667000, C257S728000, C257S659000

Reexamination Certificate

active

06974724

ABSTRACT:
A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for embedding one or more RF-chips. Advantageously, one or more layers are made of FR4 boards, each of which has a dielectric core layer between two electrically conductive foils. One of the layers has one or more openings for securing the embedded RF-chips with a bonding material such as epoxy. The electrically conductive foils on the inner layers can be etched or otherwise removed to form electrical circuits. Micro-vias can be provided through the various layers for interconnecting the electrical circuits and the RF-chips. The electrically conductive foils on the outer layers of the laminated structure can be used to provide electromagnetic shielding to the RF-chips.

REFERENCES:
patent: 5874770 (1999-02-01), Saia et al.
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6159767 (2000-12-01), Eichelberger
patent: 6489685 (2002-12-01), Asahi et al.
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6855892 (2005-02-01), Komatsu et al.

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