Stack package using anisotropic conductive film (ACF) and...

Details Stack package using anisotropic conductive film (ACF) and... Stack package using anisotropic conductive film (ACF) and...

2008-07-29

2008-07-29

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000

Reexamination Certificate

active

11905243

ABSTRACT:
Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.

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patent: 6472735 (2002-10-01), Isaak
patent: 6787917 (2004-09-01), Lee et al.
patent: 2002/0074637 (2002-06-01), McFarland
patent: 11-307717 (1999-11-01), None
patent: 10-2004-0056437 (2004-07-01), None
patent: 10-2004-0057640 (2004-07-01), None
Korean Office Action dated May 19, 2006.

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