Stack-type semiconductor package, method of forming the same...

Details Stack-type semiconductor package, method of forming the same... Stack-type semiconductor package, method of forming the same...

2008-08-29

2010-12-14

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000

Reexamination Certificate

active

07851259

ABSTRACT:
A method of forming a stack-type semiconductor package includes preparing a lower printed circuit board including a plurality of interconnections and a plurality of ball lands for connection on an upper surface thereof. One or more first chips, which are electrically connected to the plurality of interconnections and sequentially stacked, are mounted on the lower printed circuit board. A lower molded resin compound is formed on the lower printed circuit board to cover the first chips, and is formed to have via holes exposing the ball lands for connection. An upper chip package, under which solder balls are formed, is aligned so that the solder balls correspond to the via holes of the lower molded resin compound, respectively. The solder balls are reflown to form connection conductors filling the via holes. A stack-type semiconductor package structure and an electronic system including the same are also provided.

REFERENCES:
patent: 5450283 (1995-09-01), Lin et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5973393 (1999-10-01), Chia et al.
patent: 6847104 (2005-01-01), Huang et al.
patent: 6847109 (2005-01-01), Shim
patent: 2003/0194834 (2003-10-01), Watase et al.
patent: 2008/0157328 (2008-07-01), Kawata
patent: 2008/0315385 (2008-12-01), Gerber et al.
patent: 2004-349495 (2004-12-01), None
patent: 2006-120935 (2006-05-01), None
patent: 2006-303079 (2006-11-01), None
patent: 2006-49094 (2006-05-01), None
patent: 10-652397 (2006-07-01), None

Affiliated with

Also associated with

Rating

Stack-type semiconductor package, method of forming the same... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stack-type semiconductor package, method of forming the same..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stack-type semiconductor package, method of forming the same... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4202589