Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1998-06-29
2000-12-12
Bowers, Charles
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438109, 438 4, 438928, H01L 2144, H01L 2100
Patent
active
061597678
ABSTRACT:
Multichip and single chip modules are presented as well as a chips first fabrication of such modules. The multichip module comprises a plurality of chips affixed in a planar array by a structural material which surrounds the sides of the chips such that the upper surfaces of the chips and an upper surface of the structural material are co-planar and the lower surface of at least one chip and a lower surface of the structural material are co-planar. A photo-patternable dielectric is disposed directly on the upper surfaces of the chips. The photo-patternable dielectric includes vias to at least some contact pads at the upper surfaces of the chips and the module further comprises an intrachip metallization layer on the photo-patternable dielectric layer. Subsequent processing provides a multi-layer chip interconnect structure over the intrachip metallization layer and photo-patternable dielectric. Testing and repair of the module can be accomplished prior to or subsequent to fabrication of the multi-layer chip interconnect. Formation of multiple single chip modules is accomplished by singulating the multichip module into individual packages.
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Bowers Charles
EPIC Technologies, Inc.
Kebede Brook
LandOfFree
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