Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-04-03
2007-04-03
Potter, Roy Karl (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000
Reexamination Certificate
active
11067727
ABSTRACT:
The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.
REFERENCES:
patent: 5789068 (1998-08-01), King et al.
patent: 6387499 (2002-05-01), Sohma et al.
patent: 6416590 (2002-07-01), Hirata et al.
patent: 08-164496 (1996-06-01), None
patent: 10-135618 (1998-05-01), None
patent: 10-166177 (1998-06-01), None
patent: 2000-24791 (2000-01-01), None
patent: 2003-317682 (2000-11-01), None
Iwata Kengo
Sato Koji
Hitachi Metals Ltd.
Potter Roy Karl
LandOfFree
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