Solder pillar bumping and a method of making the same

Details Solder pillar bumping and a method of making the same Solder pillar bumping and a method of making the same

2006-10-31

2010-11-09

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S778000

Reexamination Certificate

active

07829380

ABSTRACT:
A method of forming flip chip bumps includes forming a plurality of metallization pads on a die. In another step, a structured layer having pores is formed on the die and metallization pads where the pads on the die are exposed through the pores. In yet another step, the die is transferred to a chamber having a liquid metal bath. In another step, a first pressure is created within the chamber followed by dipping the die in the liquid metal bath. In another step, a second pressure is created within the chamber such that liquid metal fills portions of the pores thereby forming metal pillars connected to the pads.

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patent: 2006/0261493 (2006-11-01), Boon
patent: 01144653 (1989-06-01), None

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