Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2004-11-30
2010-10-19
Gurley, Lynne A (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C438S108000, C438S111000, C438S113000, C438S114000, C438S107000, C438S110000, C438S112000, C438S118000, C257S666000, C257SE23052
Reexamination Certificate
active
07816182
ABSTRACT:
A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die extending further toward the leads than does the die paddle. With this arrangement, the active circuit areas of both integrated circuit die can face in the same direction, and can be wire bonded to the same surfaces of the leads. This avoids wire bonding complications that are often encountered in multichip integrated circuit package designs.
REFERENCES:
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5527740 (1996-06-01), Golwalkar et al.
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5719436 (1998-02-01), Kuhn
patent: 5793101 (1998-08-01), Kuhn
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 6087722 (2000-07-01), Lee et al.
patent: 6316727 (2001-11-01), Liu
patent: 6552418 (2003-04-01), Misumi et al.
patent: 6559526 (2003-05-01), Lee et al.
patent: 6700206 (2004-03-01), Kinsman
patent: 6943061 (2005-09-01), Sirinorakul et al.
patent: 6955941 (2005-10-01), Bolken
patent: 7101620 (2006-09-01), Poddar et al.
patent: 2002/0121680 (2002-09-01), Ahn et al.
patent: 2003/0020177 (2003-01-01), Oka
patent: 2003/0022465 (2003-01-01), Wachtler
patent: 2003/0162325 (2003-08-01), Tan et al.
patent: 2004/0021234 (2004-02-01), Shibata
patent: 61-116846 (1986-06-01), None
patent: 5-109975 (1993-04-01), None
patent: 11-111758 (1999-04-01), None
patent: 11-163253 (1999-06-01), None
European Search Report dated Aug. 18, 2009 in connection with European Patent No. EP 05 25 7300.
Kho Chek-Lim
Loo Kum-Weng
Gurley Lynne A
Im Junghwa M
Jorgenson Lisa K.
Munck William A.
STMicroelectronics Asia Pacific Pte. Ltd.
LandOfFree
Simplified multichip packaging and package design does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Simplified multichip packaging and package design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Simplified multichip packaging and package design will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4207938