Flip-chip assembly of semiconductor devices using adhesives

Flip-chip assembly with improved interconnect

Flip-chip attach structure and method

Flip-chip bonding method

Flip-chip bonding method

Flip-chip micromachine package fabrication method

Flip-chip package with optimized encapsulant adhesion and...

Flip-chip packaging method for light emitting diode with...

Flip-chip packaging process utilizing no-flow underfill...

Flip-chip semiconductor package structure and process for...

Flip-chip sub-assembly, methods of making same and device...

Flip-chip system and method of making same

Flip-chip technique for chip assembly

Flip-chip type semiconductor device and method of...

Flip-flop semiconductor device packaging using an interposer

Fluxless assembly of chip size semiconductor packages

Fluxless flip chip interconnection

Folded interposer

Forced heat transfer apparatus for heating stacked dice

Forming a 3-D semiconductor die structure with an...