Flip-chip sub-assembly, methods of making same and device...

Details Flip-chip sub-assembly, methods of making same and device... Flip-chip sub-assembly, methods of making same and device...

2006-10-24

2006-10-24

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S113000, C438S508000

Reexamination Certificate

active

07125746

ABSTRACT:
An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.

REFERENCES:
patent: 5438477 (1995-08-01), Pasch
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6077382 (2000-06-01), Watanabe
patent: 6108210 (2000-08-01), Chung
patent: 6241145 (2001-06-01), Maeda et al.
patent: 6281450 (2001-08-01), Urasaki et al.
patent: 6287944 (2001-09-01), Hara et al.
patent: 6312551 (2001-11-01), Murayama et al.
patent: 6429528 (2002-08-01), King et al.
patent: 2002/0185710 (2002-12-01), Zandman et al.
patent: 2003/0036249 (2003-02-01), Bauer et al.

Affiliated with

Also associated with

Rating

Flip-chip sub-assembly, methods of making same and device... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip sub-assembly, methods of making same and device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip sub-assembly, methods of making same and device... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3660547