Flip-chip bonding method

Details Flip-chip bonding method Flip-chip bonding method

1997-02-04

1999-04-27

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438107, 257778, H01L 2348

Patent

active

058973354

ABSTRACT:
An improved flip-chip bond connection and bonding method uses a "press fit" bond between a set of bond pad bumps or projections on a semiconductor chip and corresponding set of substrate bumps or projections on a substrate to self-align the chip with the substrate and enable flip-chips to be inexpensively bonded to substrates or packages with greater accuracy and a smaller pad pitch than previously achieved. In the method after normally one of the sets of bond pad bumps or substrate bumps has been cooled to shrink or contract so that the facing surfaces of each of the pad bumps and substrate bumps can be interdigitated, the chip and substrate are moved together so that the respective bumps are in a substantially common plane. The one cooled set of bumps is then warmed to expand that set of bumps sufficiently to form a lateral press-fit force between the facing surfaces, physically securing and electrically connecting the respective sets of bumps.

REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 4949148 (1990-08-01), Bartelink
patent: 5061989 (1991-10-01), Yen et al.
patent: 5570273 (1996-10-01), Siegel et al.
patent: 5675889 (1997-10-01), Acocella et al.

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