Flip-chip packaging method for light emitting diode with...

Details Flip-chip packaging method for light emitting diode with... Flip-chip packaging method for light emitting diode with...

2008-05-07

2009-08-04

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S022000, C438S025000, C438S026000, C438S048000, C438S051000, C438S054000, C438S055000, C257SE21503, C257SE21511, C257SE33057

Reexamination Certificate

active

07569420

ABSTRACT:
A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting substrate. The flip-chip packaging structure comprises a thermal and electrical conducting substrate having an insulating layer formed in an appropriate area on the top surface of the substrate and a bonding pad formed on top of the insulating layer; and a LED reversed in a flip-chip style and joined to the substrate by eutectic bonding. A first electrode of the LED is eutectically bonded to an appropriate area on the top surface of the substrate via a eutectic layer, while a second electrode of the LED is electrically connected to the bonding pad.

REFERENCES:
patent: 4905075 (1990-02-01), Temple et al.
patent: 6514782 (2003-02-01), Wierer, Jr. et al.
patent: 2007/0262342 (2007-11-01), Kobayashi et al.
patent: 2008/0036362 (2008-02-01), Tanimoto et al.

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