Forced heat transfer apparatus for heating stacked dice

Details Forced heat transfer apparatus for heating stacked dice Forced heat transfer apparatus for heating stacked dice

2005-12-29

2009-06-09

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S118000, C257SE23020, C257SE23099

Reexamination Certificate

active

07544539

ABSTRACT:
An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet positionable adjacent to the first die is configured to project a hot gas onto bond pads of the first die for bringing the bond pads to a desired bonding temperature, thereby rapidly heating the first die for effective wire bonding.

REFERENCES:
patent: 6444943 (2002-09-01), Barnett
patent: 6500760 (2002-12-01), Peterson et al.
patent: 2006/0254712 (2006-11-01), Soliz et al.
patent: 2007/0010083 (2007-01-01), Aoh et al.

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