Flip-chip system and method of making same

Details Flip-chip system and method of making same Flip-chip system and method of making same

2002-10-28

2008-12-30

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S613000, C257SE21503

Reexamination Certificate

active

07470564

ABSTRACT:
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.

REFERENCES:
patent: 6180696 (2001-01-01), Wong et al.
patent: 6586843 (2003-07-01), Sterrett et al.
patent: 6649446 (2003-11-01), Goetz et al.
patent: 6730540 (2004-05-01), Siniaguine
patent: 6794761 (2004-09-01), Shi et al.
patent: 6841415 (2005-01-01), Suzuki et al.
patent: 6969914 (2005-11-01), Fuller et al.
patent: 2001/0014399 (2001-08-01), Jasne
patent: 2003/0080437 (2003-05-01), Gonzalez et al.
patent: 2003/0226254 (2003-12-01), Koning et al.
patent: 2005/0054143 (2005-03-01), Skokov et al.
patent: WO-9921226 (1999-04-01), None
patent: WO-0031183 (2000-06-01), None
patent: WO-03036692 (2003-05-01), None
Garrou et al. . (NPL: Underfill Adhesion to BCB(CycloteneTM) Bumping and Redistribution Dielectrics) Aug. 2000, IEEE Transctions on advanced packaging, vol. 23, No. 3, p. 568-573.
Chan, Y. C., et al., “The Effect of Metal Oxide on the No-Flow Underfill Fluxing Capacity”,Materials Science and Engineering, B85, (Aug. 6, 2001), 64-69.
Vo, H. T., et al., “Towards Model-Based Engineering of Underfill Materials: CTE Modeling”,Microelectronics Journal, 32, (Apr. 1, 2001), 331-338.

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