Forming a 3-D semiconductor die structure with an...

Details Forming a 3-D semiconductor die structure with an... Forming a 3-D semiconductor die structure with an...

2011-08-09

2011-08-09

Vu, David (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S778000, C257S780000

Reexamination Certificate

active

07993971

ABSTRACT:
A method for forming a semiconductor structure includes forming a first contact pad on a first die, wherein the first contact pad comprises a first metal element, forming a metal over the first contact pad, wherein the metal comprises a second metal element, and the second metal element is different from the first metal element. The method further includes rapidly reflowing a portion of the metal to form a thin intermetallic layer. The method further includes attaching the first contact pad of the first die to a second contact pad of a second die, wherein attaching comprises heating the first contact pad and the second contact pad to reflow the metal to form an intermetallic layer such that substantially all of the metal formed over the first contact pad is used as part of the intermetallic layer.

REFERENCES:
patent: 4950623 (1990-08-01), Dishon
patent: 5234149 (1993-08-01), Katz et al.
patent: 5660321 (1997-08-01), Ishida et al.
patent: 6222279 (2001-04-01), Mis et al.
patent: 6352192 (2002-03-01), Lee et al.
patent: 6375062 (2002-04-01), Higdon et al.
patent: 2002/0020551 (2002-02-01), Rinne et al.
patent: 2004/0072416 (2004-04-01), Fay
patent: 2004/0206801 (2004-10-01), Mis et al.
patent: 2006/0030139 (2006-02-01), Mis et al.
patent: 2006/0278954 (2006-12-01), Izumi
patent: 2007/0111384 (2007-05-01), Kinoshita et al.

Affiliated with

Also associated with

Rating

Forming a 3-D semiconductor die structure with an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Forming a 3-D semiconductor die structure with an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Forming a 3-D semiconductor die structure with an... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2766820