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Method to reduce STI HDP-CVD USG deposition induced defects

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Method to reduce trench cone formation in the fabrication of...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Method to solve the dishing issue in CMP planarization by...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Method using TEOS ramp-up during TEOS/ozone CVD for improved...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Method(s) of forming a thin layer

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methodology for achieving dual field oxide thicknesses

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods and systems to mitigate etch stop clipping for...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods and systems to mitigate etch stop clipping for...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods for barrier layer formation

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Methods for etching silicon dioxide; and methods for forming...

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Methods for fabricating an STI film of a semiconductor device

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Methods for fabricating semiconductor devices having reduced...

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Methods for filling high aspect ratio trenches in...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods for filling high aspect ratio trenches in...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods for filling shallow trench isolations having high...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods for filling trenches in a semiconductor wafer

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods for forming a device isolating barrier and methods...

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Methods for forming a trench isolation structure with...

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Methods for forming isolation trenches including doped silicon o

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Methods for forming shallow trench isolation structures

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