Resistor random access memory cell with reduced active area...
Resputtering to achieve better step coverage
Retardation layer for preventing diffusion of metal layer and fa
Reticle for creating resist-filled vias in a dual damascene...
Reverse mask and nitride layer deposition for reduction of...
Reverse mask and oxide layer deposition for reduction of...
Reversed damascene process for multiple level metal...
Rework method for wafers that trigger WCVD backside alarm
Ring positionable about a periphery of a contact pad,...
Ring positionable about a periphery of a contact pad,...
Robust diffusion barrier for Cu metallization
Robust end-point detection for contact and via etching
Robust interconnect structure
Robust post Cu-CMP IMD process
Robust pressure aluminum fill process
Robust ultra-low k interconnect structures using...
Room temperature-operating single-electron device and the...
Routing for multilayer ceramic substrates to reduce...
Routingless chip architecture
RPO process for selective CoSix formation