Integrated circuit having a top side wafer contact and a...
Integrated circuit having a void between adjacent conductive lin
Integrated circuit having a void between adjacent conductive...
Integrated circuit having amorphous silicide layer in contacts a
Integrated circuit having conductive paths of different...
Integrated circuit having conductors of enhanced cross-sectional
Integrated circuit having horizontally and vertically offset int
Integrated circuit having local interconnect for reducing signal
Integrated circuit having oversized components and method of...
Integrated circuit having reduced probability of wire-bond failu
Integrated circuit having structural support for a flip-chip...
Integrated circuit including passivated copper...
Integrated circuit inductane and the fabrication method thereof
Integrated circuit insulated electrode forming methods using...
Integrated circuit interconnect lines having sidewall layers
Integrated circuit manufacturing method using hard mask
Integrated circuit metal silicide method
Integrated circuit metallization using a titanium/aluminum...
Integrated circuit package and method for producing it
Integrated circuit package configuration having an...