Integrated circuit metal silicide method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S721000, C438S684000, C438S306000, C438S655000, C438S151000, C438S197000, C257SE21203, C257SE21204, C257SE21296, C257SE21593, C257SE21622, C257SE21636

Reexamination Certificate

active

11073982

ABSTRACT:
Fluorine containing regions (70) are formed in the source and drain regions (60) of the MOS transistor. A metal layer (90) is formed over the fluorine containing regions (70) and the source and drain regions (60). The metal layer is reacted with the underlying fluorine containing regions to form a metal silicide.

REFERENCES:
patent: 7060610 (2006-06-01), Lee
patent: 2001/0045605 (2001-11-01), Miyashita et al.
patent: 2004/0101999 (2004-05-01), Oda et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit metal silicide method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit metal silicide method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit metal silicide method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3763662

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.