Integrated circuit having structural support for a flip-chip...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S771000, C257SE23142, C257SE21575, C257SE21627

Reexamination Certificate

active

11033009

ABSTRACT:
A technique for alleviating the problems of defects caused by stress applied to bond pads (32) includes, prior to actually making an integrated circuit (10), adding dummy metal lines (74, 76) to interconnect layers (18, 22, 26) to increase the metal density of the interconnect layers. These problems are more likely when the interlayer dielectrics (16, 20, 24) between the interconnect layers are of a low-k material. A critical area or force area (64) around and under each bond pad defines an area in which a defect may occur due to a contact made to that bond pad. Any interconnect layer in such a critical area that has a metal density below a certain percentage can be the cause of a defect in the interconnect layers. Any interconnect layer that has a metal density below that percentage in the critical area has dummy metal lines added to it.

REFERENCES:
patent: 5149674 (1992-09-01), Freeman, Jr. et al.
patent: 5514892 (1996-05-01), Countryman et al.
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 5923088 (1999-07-01), Shiue et al.
patent: 6144100 (2000-11-01), Shen et al.
patent: 6187658 (2001-02-01), Chittipeddi et al.
patent: 6232662 (2001-05-01), Saran
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6384486 (2002-05-01), Zuniga et al.
patent: 6614091 (2003-09-01), Downey et al.
patent: 2002/0025417 (2002-02-01), Chisholm et al.
patent: 2003/0020163 (2003-01-01), Hung et al.
patent: 2005/0082577 (2005-04-01), Usui
Wintgens, Carl; “Detailed Structural Analysis I of the Oki Electric Co. Ltd. L67Q4003 32-Bit Microcontroller with Optional Analyses”; Sep. 2004.
U.S. Appl. No. 11/033,008.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit having structural support for a flip-chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit having structural support for a flip-chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit having structural support for a flip-chip... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3740031

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.