Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-07-24
2007-07-24
Sarkar, Asok Kumar (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S771000, C257SE23142, C257SE21575, C257SE21627
Reexamination Certificate
active
11033009
ABSTRACT:
A technique for alleviating the problems of defects caused by stress applied to bond pads (32) includes, prior to actually making an integrated circuit (10), adding dummy metal lines (74, 76) to interconnect layers (18, 22, 26) to increase the metal density of the interconnect layers. These problems are more likely when the interlayer dielectrics (16, 20, 24) between the interconnect layers are of a low-k material. A critical area or force area (64) around and under each bond pad defines an area in which a defect may occur due to a contact made to that bond pad. Any interconnect layer in such a critical area that has a metal density below a certain percentage can be the cause of a defect in the interconnect layers. Any interconnect layer that has a metal density below that percentage in the critical area has dummy metal lines added to it.
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U.S. Appl. No. 11/033,008.
Hess Kevin J.
Leung Pak K.
Pozder Scott K.
Travis Edward O.
Wilkerson Brett P.
Clingan, Jr. James L.
Freescale Semiconductor Inc.
King Robert L.
Sarkar Asok Kumar
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