Deposition methods for barrier and tungsten materials
Deposition methods for barrier and tungsten materials
Deposition methods using heteroleptic precursors
Deposition of a conductor in a via hole or trench
Deposition of amorphous silicon films by high density plasma...
Deposition of carbon and nitrogen doped poly silicon films,...
Deposition of conformal copper seed layers by control of...
Deposition of diffusion barrier
Deposition of in-situ doped semiconductor film and undoped...
Deposition of titanium amides
Deposition of titanium nitride films having improved uniformity
Deposition of transition metal carbides
Deposition of tungsten films from W(CO)6
Deposition of tungsten nitride
Deposition of various base layers for selective layer growth...
Deposition process for coating or filling re-entry shaped contac
Depth of focus (DOF) for trench-first-via-last (TFVL)...
Design layout method for metal lines of an integrated circuit
Design structure for final via designs for chip stress...
Design structures incorporating interconnect structures with...