Integrated circuit resistant to the formation of cracks in a...
Integrated circuit waveguide
Integrated high density plasma chemical vapor deposition...
Integrated polishing and electroless deposition
Integration scheme for dual damascene structure
Integration scheme for metal gap fill, with fixed abrasive CMP
Inter-layer connection structure, multilayer printed circuit...
Interconnect structure and method to achieve unlanded vias for l
Interlevel dielectric composite layer for insulation of...
Isolation and/or removal of ionic contaminants from...
Isolation method utilizing a high pressure oxidation
Key-hole reduction during tungsten plug formation
L-shaped spacer incorporating or patterned using amorphous...
Lapping carrier, apparatus for lapping a wafer and method of...
Laser ablation to selectively thin wafers/die to lower...
Layer independent alignment system
Light sensitive chemical-mechanical polishing method
Linear CMP tool design using in-situ slurry distribution and...
Linear CMP tool design with closed loop slurry distribution
Lining and corner rounding method for shallow trench isolation