Lapping carrier, apparatus for lapping a wafer and method of...

Details Lapping carrier, apparatus for lapping a wafer and method of... Lapping carrier, apparatus for lapping a wafer and method of...

2007-03-27

2007-03-27

Norton, Nadine G. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S692000, C438S693000, C451S402000, C451S403000

Reexamination Certificate

active

10434772

ABSTRACT:
A method of fabricating a lapping carrier is provided that includes the steps of defining at least one opening extending through a workpiece that is sized to receive a wafer, and cryogenically tempering the workpiece to produce a lapping carrier. By cryogenically tempering the workpiece, the conversion of the crystalline structure of the workpiece to a martensite crystalline structure is enhanced, thereby improving the hardness of the lapping carrier. A lapping carrier is also provided that has a crystalline structure, of which at least 70% is a martensite crystalline structure. An apparatus for lapping a wafer is further provided that includes a hardened lapping carrier and at least one lapping plate proximate the lapping carrier for lapping wafer(s) disposed within the at least one opening defined by the lapping carrier.

REFERENCES:
patent: 4739622 (1988-04-01), Smith
patent: 5422316 (1995-06-01), Desai et al.
patent: 5914053 (1999-06-01), Masumura et al.
patent: 6030280 (2000-02-01), Fruitman
patent: 6042688 (2000-03-01), Masumura et al.
patent: 6454635 (2002-09-01), Zhang et al.
patent: 6514424 (2003-02-01), Wenski et al.
patent: 6733723 (2004-05-01), Choi et al.
patent: 359024960 (1984-02-01), None

Affiliated with

Also associated with

Rating

Lapping carrier, apparatus for lapping a wafer and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lapping carrier, apparatus for lapping a wafer and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lapping carrier, apparatus for lapping a wafer and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3751275