Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2005-05-17
2005-05-17
Wojciechowicz, Edward (Department: 2815)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S692000, C438S694000, C257S333000, C257S401000
Reexamination Certificate
active
06893967
ABSTRACT:
A multilayer L-shaped spacer is formed of a lower portion comprising a CVD organic material or amorphous carbon, and an upper portion comprised of a protective material. The upper portion is patterned using a photoresist mask. During that patterning, the underlying substrate is protected by a layer of CVD organic material or amorphous carbon. The CVD organic material or amorphous carbon is then patterned using the patterned protective material as a mask. The chemistry used to pattern the CVD organic material or amorphous carbon is relatively harmless to the underlying substrate. Alternatively, an L-shaped spacer is patterned without using a photoresist mask by forming an amorphous carbon spacer around a gate that is covered with a conformal layer of a conventional spacer material. The conventional spacer material is patterned using the amorphous carbon spacer as an etch mask. The amorphous carbon spacer is easily formed without the need for lithographic patterning, and therefore this method is preferable to methods using photoresist masks.
REFERENCES:
patent: 20020179982 (2002-12-01), Cheng et al.
patent: 20040072435 (2004-04-01), Quek
Bonser Douglas J.
Hellig Kay
Wright Marilyn I.
You Lu
Advanced Micro Devices , Inc.
Foley & Lardner LLP
Wojciechowicz Edward
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