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Dielectric protected chemical-mechanical polishing in...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dielectric trenches, nickel/tantalum oxide structures, and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Differential planarization

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Differential pressure chemical-mechanical polishing in...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Differential temperature control in chemical mechanical polishin

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dishing inhibited shallow trench isolation

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dishing resistance

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Double-side polishing process with reduced scratch rate and...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Double-sided polishing process for producing a multiplicity...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dry etching endpoint procedure to protect against photolithograp

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dual damascene manufacturing process

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dual slurry particle sizes for reducing microscratching of...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dummy structures that protect circuit elements during polishing

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Dynamically adjustable slurry feed arm for wafer edge...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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EBR shape of spin-on low-k material providing good film...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Edge and bevel cleaning process and system

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Edge removal of silicon-on-insulator transfer wafer

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Edge removal of silicon-on-insulator transfer wafer

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Edge removal of silicon-on-insulator transfer wafer

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Electro-mechanical polishing of platinum container structure

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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