Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2007-02-13
2007-02-13
Tran, Thien F. (Department: 2811)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S692000
Reexamination Certificate
active
10753826
ABSTRACT:
In accordance with the objectives of the invention a new method is provided to tune the Edge Bead Remove hump and to further prevent a pointed or tip shaped Edge Bead Remove edge, thus preventing peeling of the low-k dielectric film after the process of Chemical Mechanical Polishing of the low-k film.
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patent: 6080641 (2000-06-01), Nihonmatsu et al.
patent: 6114747 (2000-09-01), Wei et al.
patent: 2004/0041143 (2004-03-01), Kim et al.
Chen Yu-Huei
Jang Sung-Ming
Yu Chen-Hua
Haynes and Boone LLP
Taiwan Semiconductor Manufacturing Company , Ltd.
Tran Thien F.
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