EBR shape of spin-on low-k material providing good film...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

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C438S692000

Reexamination Certificate

active

10753826

ABSTRACT:
In accordance with the objectives of the invention a new method is provided to tune the Edge Bead Remove hump and to further prevent a pointed or tip shaped Edge Bead Remove edge, thus preventing peeling of the low-k dielectric film after the process of Chemical Mechanical Polishing of the low-k film.

REFERENCES:
patent: 5783382 (1998-07-01), Aoyama et al.
patent: 5879577 (1999-03-01), Weng et al.
patent: 6080641 (2000-06-01), Nihonmatsu et al.
patent: 6114747 (2000-09-01), Wei et al.
patent: 2004/0041143 (2004-03-01), Kim et al.

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