Differential planarization

Details Differential planarization Differential planarization

2005-07-05

2005-07-05

Wilson, Christian (Department: 2829)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C438S692000

Reexamination Certificate

active

06914002

ABSTRACT:
Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques.

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