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Method of simultaneously polishing a plurality of objects of...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of single step damascene process for deposition and globa

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of spin etching wafers with an alkali solution

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of thinning semiconductor wafer capable of preventing...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of thinning semiconductor wafer of smaller diameter than

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of treating a structured surface

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of treating conductive layer for use in a circuitized...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of treating surface of semiconductor substrate

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of using a polish stop film to control dishing during cop

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of using films having optimized optical properties...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method of using organic material to enhance STI...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method op optimizing vias between conductive layers in an...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to achieve STI planarization

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to avoid copper contamination during copper etching...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to create a copper dual damascene structure with less...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to eliminate via poison effect

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to fabricate layered material compositions

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to form a low parasitic capacitance pseudo-SOI CMOS...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to form self-sealing air gaps between metal...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Method to form shallow trench isolation structures for...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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