Method of treating surface of semiconductor substrate

Details Method of treating surface of semiconductor substrate Method of treating surface of semiconductor substrate

2008-10-24

2010-11-23

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S906000, C134S002000, C134S902000, C257SE21228

Reexamination Certificate

active

07838425

ABSTRACT:
A method of treating the surface of a semiconductor substrate has cleaning the semiconductor substrate having a pattern formed thereon by using a chemical solution, removing the chemical solution by using pure water, forming a water repellent protective film on the surface of the semiconductor substrate, rinsing the semiconductor substrate by using pure water, and drying the semiconductor substrate.

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Notification of Reasons for Rejection issued by the Japanese Patent Office on Jul. 10, 2009, for Japanese Patent Application No. 2009-140992, and English-language translation thereof.

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