Method of thinning semiconductor wafer capable of preventing...

Details Method of thinning semiconductor wafer capable of preventing... Method of thinning semiconductor wafer capable of preventing...

2006-01-10

2006-01-10

Deo, Duy-Vu N. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S691000, C438S692000

Reexamination Certificate

active

06984586

ABSTRACT:
In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

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