Method of thinning semiconductor wafer of smaller diameter than

Details Method of thinning semiconductor wafer of smaller diameter than Method of thinning semiconductor wafer of smaller diameter than

1998-09-16

2000-01-25

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

H01L 21302

Patent

active

060178221

ABSTRACT:
A method of thinning a product wafer using equipment designed for a wafer diameter, where the diameter of the product wafer is smaller than the wafer diameter of the thinning equipment by cutting an opening in a template wafer, where the template wafer is of a diameter that may be thinned by the thinning equipment, and where the opening accommodates the product wafer; affixing the template wafer to a holding material; affixing the product wafer to the holding material and inside of the template wafer with the integrated circuit side up; depositing an etch stop onto a handle wafer, where the handle wafer is at least as large as the template wafer; bonding adhesively the product wafer to the etch stop; removing the holding material; filling any gaps between the product wafer and the template wafer; using wax to make the product wafer sufficiently planar; thinning the product wafer using the thinning equipment; removing any excess wax; bonding adhesively the product wafer to a transfer wafer, where the transfer wafer is at least as large as the template wafer; removing the handle wafer; removing the etch stop; and removing any adhesive that remains on the product wafer.

REFERENCES:
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4946716 (1990-08-01), Corrie
patent: 5071792 (1991-12-01), VanVonno et al.
patent: 5256599 (1993-10-01), Asetta et al.
patent: 5273940 (1993-12-01), Sanders
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5344524 (1994-09-01), Sharma et al.
patent: 5348607 (1994-09-01), Wojnarowski et al.
patent: 5656552 (1997-08-01), Hudak et al.
patent: 5893755 (1999-04-01), Nakayoshi
patent: 5927993 (1999-07-01), Lesk et al.
U.S. application No. 08/900,869, Mountain, filed Jul. 25, 1997.

Affiliated with

Also associated with

Rating

Method of thinning semiconductor wafer of smaller diameter than does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of thinning semiconductor wafer of smaller diameter than , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of thinning semiconductor wafer of smaller diameter than will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2315706