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Solder bump interconnection formed using spaced solder deposit a

Metal fusion bonding – Process – Plural joints
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Solder bump stretch device

Metal fusion bonding – Process – Plural joints
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Solder bump transfer device for flip chip integrated circuit dev

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Solder coated material and method for its manufacture

Metal fusion bonding – Process – Plural joints
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Solder contact reworking using a flux plate and squeegee

Metal fusion bonding – Process – Plural joints
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Solder delivery system

Metal fusion bonding – Process – Plural joints
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Solder hierarchy for chip attachment to substrates

Metal fusion bonding – Process – Plural joints
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Solder interconnection array with optimal mechanical integrity

Metal fusion bonding – Process – Plural joints
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Solder interconnection array with optimal mechanical integrity

Metal fusion bonding – Process – Plural joints
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Solder interconnects for selective line coupling

Metal fusion bonding – Process – Plural joints
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Solder joint structure and method for soldering electronic...

Metal fusion bonding – Process – Plural joints
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Solder pads and method of making a solder pad

Metal fusion bonding – Process – Plural joints
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Solder preforms in a cast array

Metal fusion bonding – Process – Plural joints
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Solder printing using a stencil having a reverse-tapered...

Metal fusion bonding – Process – Plural joints
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Solder process and solder alloy therefor

Metal fusion bonding – Process – Plural joints
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Solder process for enhancing reliability of multilayer hybrid ci

Metal fusion bonding – Process – Plural joints
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Solder protective coating and fluxless joining of flip chip...

Metal fusion bonding – Process – Plural joints
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Solder reflow furnace with flux effluent collector and...

Metal fusion bonding – Process – Plural joints
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Solder self-alignment methods

Metal fusion bonding – Process – Plural joints
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Solder standoffs for injection molding of solder

Metal fusion bonding – Process – Plural joints
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