Solder interconnects for selective line coupling

Details Solder interconnects for selective line coupling Solder interconnects for selective line coupling

1989-11-09

1991-01-08

Heinrich, Sam

Metal fusion bonding

Process

Plural joints

228215, 228248, 29846, 29829, 174261, 361406, B23K10142, H05K 334

Patent

active

049828924

ABSTRACT:
A structure and method for selectively forming interconnections between the interconnect lines of a printed circuit board. At the same time solder is deposited through a solder application mask to bond the modules to the board, solder is also deposited on pad interconnect structures between the interconnect lines. Thus, line interconnections can be formed at minimal additional cost, reducing the number of different boards needed to mount different sets of modules or alternate component or circuit configurations. In a preferred embodiment, the pads comprise an arcuate member and an elongated member extending within the arc described by the arcuate member. By optimizing the spacing between the members, the total area of the members, and the volume of the solder, a highly reliable solder fillet interconnection can be formed.

REFERENCES:
patent: 3528048 (1970-09-01), Kirk
patent: 3681134 (1972-08-01), Nathanson et al.
patent: 4296272 (1981-10-01), Schelhorn
patent: 4413309 (1983-11-01), Takahashi et al.
IBM Technical Disclosure Bulletin, "Nonconcentric Solder Reflow Technique for Close-Packed Lands", vol. 13, No. 1, pp. 155, 6, Jun. 1970.
IBM Technical Disclosure Bulletin, "Reusable Interconnection Matrix", vol. 13, No. 2, p. 433, Jul. 1970.

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