Solder joint structure and method for soldering electronic...

Details Solder joint structure and method for soldering electronic... Solder joint structure and method for soldering electronic...

2005-08-16

2005-08-16

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S248100

Reexamination Certificate

active

06929169

ABSTRACT:
A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the previous temperature to connect the lead terminal to the second solder section by fusion bonding.

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patent: 2002-066783 (2002-03-01), None
patent: 2002-158438 (2002-05-01), None

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