Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-01-24
2006-01-24
Edmondson, L. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S039000, C228S041000, C228S180220, C118S504000, C118S721000
Reexamination Certificate
active
06988652
ABSTRACT:
A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).
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Chouta Prashant
Craig Scott
Fleck Ian McPhee
Tripp Ron
Edmondson L.
Fry's Metals, Inc.
Mintz Levin Cohn Ferris Glovsky and Popeo P.C.
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