Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-04-25
2006-04-25
Kerns, Kevin (Department: 1725)
Metal fusion bonding
Process
Plural joints
C228S207000
Reexamination Certificate
active
07032807
ABSTRACT:
Solder contacts can be formed on the conductive sites of a substrate by placing preformed solder balls on the conductive sites and then reflowing the solder balls to bond the solder balls to the conductive sites. After formation of the solder contacts, solder flux can be applied to at least a portion of the solder contacts. The solder contacts can then be reflowed to substantially improve the adhesion of the solder contacts to the conductive sites and increase the shear strength of the solder contacts.
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Aboagye Michael
Brady III Wade James
Kerns Kevin
Tung Yingsheng
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